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Hike News

【IC】BLANK.01 - Minimal 60% board with dual mounting option

类型: IC
作者: Suiscythe
发布时间: 2021-11-17 22:39:50
更新时间: 2021-11-18 02:34:35
原链接: https://geekhack.org/index.php?topic=115343.0


BLΛNK.01
A minimal looking 60% keyboard with dual mounting option.
Introduction
This board was heavily inspired by the look of RAMA M60-a and the feel of Thermal with a bit of challenge I made for myself to incorporate PCB gasket mount into the design.
I designed a new leafspring plate based on Thermal plate design, focusing on even more bouncy typing feel and the minimal look of the RAMA M60-a.
As the leafspring plate required more space to operate effectively, thicker chin is unavoidable. However, it does look nice for the winkey and winkeyless variant in my opinion.
Moving on to the PCB gasket mount, I also a fan of the unique typing feel and sound of PCB gasket mount keyboards.
So I decided to incorporate it into BLANK.01, allowing an option for users to choose between bouncy typing feel of the leafspring aluminium plate
or a softer, more dampened typing feel of the PCB gasket mount along with selection of plates for you to further customizing the sound and feel of your board.
Minimal design is considered into this board, featuring polished stainless steel badge, seamless, screwless design and a low USB connector that sits parallel to the desk.



Specs:

  • Form factor: 60% screwless, seamless design
  • Layouts: WK, WKL, HHKB w/ fixed 7u spacebar, stepped/full capslock, split/full backspace
  • Typing angle: 8 degress
  • Case Material: Aluminium & Brass (weight around 3kg.)
  • Mounting: Dual mounting - leafspring plate OR PCB gasket mount
  • Plate Material:
  • Leafspring - only aluminium
  • PCB gasket mount - possibly Alu, PC, POM, and plateless
  • Colors: Two tone - Black & Silver, Other colors TBC
  • PCB:
  • Solder only
  • QMK / VIA Support
  • USB Type C daughterboard
  • Custom design in Thailand and manufactured by JLCPCB
  • Leafspring plate mount -
  • PCB gasket mount -

Prototype /#1




To do list:

  • IC Form
  • Minor revision & prototype /#2
  • Soundtest
  • Packaging
  • GB
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